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Front MatterAbstract - Hi-Res PDF (109 KB) - PDF w/links (110 KB)
Chapter 1. Fundamentals of the Design ProcessAbstract - Hi-Res PDF (590 KB) - PDF w/links (487 KB)
Chapter 2. Surface Mount TechnologyAbstract - Hi-Res PDF (706 KB) - PDF w/links (450 KB)
Chapter 3. Integrated Circuit PackagesVictor MeeldijkAbstract - Hi-Res PDF (1129 KB) - PDF w/links (425 KB)
Chapter 4. Direct Chip AttachAbstract - Hi-Res PDF (586 KB) - PDF w/links (378 KB)
Chapter 5. Circuit BoardsGlenn R BlackwellAbstract - Hi-Res PDF (538 KB) - PDF w/links (379 KB)
Chapter 6. EMC and Printed Circuit Board DesignMark I. MontroseAbstract - Hi-Res PDF (1494 KB) - PDF w/links (953 KB)
Chapter 7. Hybrid AssembliesJanet K. LumppAbstract - Hi-Res PDF (657 KB) - PDF w/links (379 KB)
Chapter 8. InterconnectsGlen R. BlackwellAbstract - Hi-Res PDF (1291 KB) - PDF w/links (869 KB)
Chapter 9. Design for TestAbstract - Hi-Res PDF (327 KB) - PDF w/links (279 KB)
Chapter 10. Adhesive and Its ApplicationRay PrasadAbstract - Hi-Res PDF (727 KB) - PDF w/links (437 KB)
Chapter 11. Thermal ManagementAbstract - Hi-Res PDF (340 KB) - PDF w/links (307 KB)
Chapter 12. TestingGarry R. Grzelak, Glenn R. BlackwellAbstract - Hi-Res PDF (409 KB) - PDF w/links (351 KB)
Chapter 13. InspectionAbstract - Hi-Res PDF (183 KB) - PDF w/links (180 KB)
Chapter 14. Package/EnclosureAbstract - Hi-Res PDF (638 KB) - PDF w/links (492 KB)
Chapter 15. Electronics Package Reliability and Failure AnalysisBruce C. Beihoff, Peter M. Stipan, Michael C. ShawAbstract - Hi-Res PDF (1304 KB) - PDF w/links (667 KB)
Chapter 16. Product Safety and Third-Party CertificationConstantin Bolintineanu, Steli LoznenAbstract - Hi-Res PDF (323 KB) - PDF w/links (324 KB)
DefinitionsAbstract - Hi-Res PDF (194 KB) - PDF w/links (195 KB)
