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http://dx.doi.org/10.1201/9781420018967
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Front MatterAbstract - Hi-Res PDF (403 KB) - PDF w/links (404 KB)
Chapter 1. Overview of Ceramic Interconnect TechnolgyDan Amey, Gangqiang WangAbstract - Hi-Res PDF (23460 KB) - PDF w/links (2159 KB)
Chapter 2. Electrical Design, Simulation, and TestingKuldeep Saxena, Daniel I. AmeyAbstract - Hi-Res PDF (1352 KB) - PDF w/links (1259 KB)
Chapter 3. ThermoMechanical DesignAl KrumAbstract - Hi-Res PDF (1699 KB) - PDF w/links (1646 KB)
Chapter 4. Ceramic MaterialsJerry E. SergentAbstract - Hi-Res PDF (3059 KB) - PDF w/links (1068 KB)
Chapter 5. Screen PrintingJerry E. SergentAbstract - Hi-Res PDF (2102 KB) - PDF w/links (1015 KB)
Chapter 6. Multilayer CeramicsArne K. Knudsen, Fred BarlowAbstract - Hi-Res PDF (3916 KB) - PDF w/links (2503 KB)
Chapter 7. Photo-Defined and Photo-Imaged FilmsTerry R. Suess, William J. NebeAbstract - Hi-Res PDF (4609 KB) - PDF w/links (1303 KB)
Chapter 8. Copper Interconnects for Ceramic Substrates and PackagesAl KrumAbstract - Hi-Res PDF (923 KB) - PDF w/links (843 KB)
Chapter 9. Integrated Passives in Ceramic SubstratesHeiko Thust, Jens MüllerAbstract - Hi-Res PDF (6480 KB) - PDF w/links (2685 KB)
