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http://dx.doi.org/10.1201/9780203021484
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Front MatterAbstract - Hi-Res PDF (751 KB) - PDF w/links (752 KB)
Chapter 1. Overview of Lead-Free Solder Issues Including SelectionAbstract - Hi-Res PDF (751 KB) - PDF w/links (745 KB)
Chapter 2. Health and Environmental Effects of Lead and Other Commonly Used Electronic Elements in MicroelectronicsEdwin B. SmithAbstract - Hi-Res PDF (529 KB) - PDF w/links (526 KB)
Chapter 3. Environmental Impact of Lead and Alternatives in ElectronicsLaura J. Turbini, Dennis BernierAbstract - Hi-Res PDF (481 KB) - PDF w/links (476 KB)
Chapter 4. Environmental Stewardship with Regional Perspectives and Drivers of the Lead-free IssueSusanna Pelzel, Minna Juuti, Yukio SugimotoAbstract - Hi-Res PDF (449 KB) - PDF w/links (450 KB)
Chapter 5. Market, Product, and Corporate Policy TrendsE. Jan VardamanAbstract - Hi-Res PDF (446 KB) - PDF w/links (448 KB)
Chapter 6. The Metallurgical Aspects, Properties, and Applications of Solders from the Lead-Tin SystemPaul T. ViancoAbstract - Hi-Res PDF (1487 KB) - PDF w/links (1510 KB)
Chapter 7. Physical Basis for Mechanical Properties of SoldersMorris E. FineAbstract - Hi-Res PDF (485 KB) - PDF w/links (496 KB)
Chapter 8. Sn-Ag and Sn-Ag-X Solders and PropertiesAbstract - Hi-Res PDF (1255 KB) - PDF w/links (1248 KB)
Chapter 9. Bi-Sn, Sn-Sb, Sn-Cu, Sn-Zn, and Sn-In Solder-Based Systems and Their PropertiesSung K. KangAbstract - Hi-Res PDF (556 KB) - PDF w/links (582 KB)
Chapter 10. High-Temperature Lead-Free Solders with DispersoidsK. N. Subramanian, Fu Guo, Sunglak ChoiAbstract - Hi-Res PDF (806 KB) - PDF w/links (832 KB)
Chapter 11. Solder Wetting and SpreadingTimothy J. Singler, Stephan J. Meschter, James SpalikAbstract - Hi-Res PDF (1311 KB) - PDF w/links (1333 KB)
Chapter 12. Lead-Free Finishes for Printed Circuit Boards and ComponentsRob SchettyAbstract - Hi-Res PDF (734 KB) - PDF w/links (733 KB)
Chapter 13. Formation of Intermetallic Compounds at Pb-Sn/Metal and Lead-Free/Metal Interfaces in Solder JointsEric J. Cotts, Robert Kinyanjui, Richard Chromik, Anis Zribi, P. BorgesenAbstract - Hi-Res PDF (940 KB) - PDF w/links (965 KB)
Chapter 14. Electronics Assembly and the Impact of Lead-Free MaterialsAnthony A. PrimaveraAbstract - Hi-Res PDF (2247 KB) - PDF w/links (2260 KB)
Chapter 15. Use of Inert Atmospheres in Lead-Free SolderingMartin Theriault, Jason Uner, Armin RahnAbstract - Hi-Res PDF (447 KB) - PDF w/links (445 KB)
Chapter 16. Pb-Free Component Conversion and Some Manufacturing ExperiencesTom Baggio, Kenichiro SuetsuguAbstract - Hi-Res PDF (3274 KB) - PDF w/links (3292 KB)
Chapter 17. Major International Lead (Pb)-Free Solder StudiesCarol A. Handwerker, Frank W. Gayle, Erik E. de Kluizenaar, Katsuaki SuganumaAbstract - Hi-Res PDF (1691 KB) - PDF w/links (1682 KB)
Chapter 18. Electrically Conductive Adhesives- A Lead-Free AlternativeDaoqiang Lu, C. P. WongAbstract - Hi-Res PDF (933 KB) - PDF w/links (934 KB)
Chapter 19. Reliability Aspects of Lead-Free Solders in Electronic AssembliesPuligandla Viswanadham, Steven O. Dunford, Jorma KivilahtiAbstract - Hi-Res PDF (1870 KB) - PDF w/links (1839 KB)
Chapter 20. The Physics and Materials Science of Electromigration and Thermomigration in SoldersJames R. Lloyd, King-Ning Tu, Jasvir JaspalAbstract - Hi-Res PDF (830 KB) - PDF w/links (825 KB)
Chapter 21. The Structure and Kinetics of Tin-Whisker Formation and Growth on High Tin Content FinishesW. J. Choi, George Galyon, King-Ning Tu, T. Y. LeeAbstract - Hi-Res PDF (3455 KB) - PDF w/links (3393 KB)
Chapter 22. Degradation PhenomenaMichael J. Sullivan, Stephen J. KilpatrickAbstract - Hi-Res PDF (1390 KB) - PDF w/links (1379 KB)
BiographiesAbstract - Hi-Res PDF (333 KB) - PDF w/links (334 KB)
