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Front MatterAbstract - Hi-Res PDF (984 KB) - PDF w/links (984 KB)
Chapter 1. Electrochemical processing technologies and their impact in microelectronic packagingMadhav DattaAbstract - Hi-Res PDF (1643 KB) - PDF w/links (1653 KB)
Chapter 2. Electroplating process for Cu chip metallizationValery M. Dubin, Harsono S. Simka, Sadasivan Shankar, Peter Moon, Thomas Marieb, Madhav DattaAbstract - Hi-Res PDF (2518 KB) - PDF w/links (2427 KB)
Chapter 3. Electroless barrier and seed layers for on- chip metallizationValery M. Dubin, Sergey Lopatin, Amit Kohn, Nick Petrov, Moshe Eizenberg, Yosi Shacham-DiamandAbstract - Hi-Res PDF (3162 KB) - PDF w/links (2856 KB)
Chapter 4. Alternative materials for ULSI and MEMS metallizationYosi Shacham-Diamand, Nathan Croitoru, Alexandra Inberg, Yelena Sverdlov, Valery Dubin, Vadim BogushAbstract - Hi-Res PDF (2621 KB) - PDF w/links (2626 KB)
Chapter 5. Tape carrier and development trendOsamu Yoshioka, Akira ChindaAbstract - Hi-Res PDF (1447 KB) - PDF w/links (1282 KB)
Chapter 6. Flip-chip interconnectionMadhav DattaAbstract - Hi-Res PDF (2196 KB) - PDF w/links (2010 KB)
Chapter 7. Compliant interconnectsPaul A. KohlAbstract - Hi-Res PDF (2095 KB) - PDF w/links (1797 KB)
Chapter 8. Pb-free flip-chip technologiesDarrel R. Frear, W. H. LytleAbstract - Hi-Res PDF (1933 KB) - PDF w/links (1748 KB)
Chapter 9. Materials overview in organic packagingSaikumar Jayaraman, John Tang, Vijay S. WakharkarAbstract - Hi-Res PDF (3289 KB) - PDF w/links (2991 KB)
Chapter 10. Glass – ceramic packagesKazuhiro Ikuina, Yuzo Shimada, Kazuaki UtsumiAbstract - Hi-Res PDF (3151 KB) - PDF w/links (2668 KB)
Chapter 11. Electrochemical processes in the fabrication of multichip modulesSol Krongelb, Lubomyr T. Romankiw, Eric D. Perfecto, Keith K.H. WongAbstract - Hi-Res PDF (2699 KB) - PDF w/links (2411 KB)
Chapter 12. Bumping technology for advanced packagesShinichi WakabayashiAbstract - Hi-Res PDF (1897 KB) - PDF w/links (1756 KB)
Chapter 13. Plated through-hole technology for boardsHaruo AkahoshiAbstract - Hi-Res PDF (1886 KB) - PDF w/links (1806 KB)
Chapter 14. Electroplated contact materials for connectors and relaysYutaka OkinakaAbstract - Hi-Res PDF (1038 KB) - PDF w/links (1035 KB)
Chapter 15. Chemical – mechanical planarizationDavid K. Watts, Norio Kimura, Manabu TsujimuraAbstract - Hi-Res PDF (3069 KB) - PDF w/links (2844 KB)
Chapter 16. Electrochemical deposition equipmentTom Ritzdorf, Dakin FultonAbstract - Hi-Res PDF (3039 KB) - PDF w/links (2812 KB)
Chapter 17. Processes and equipment for wet etching and cleaningJeffery W. ButterbaughAbstract - Hi-Res PDF (1279 KB) - PDF w/links (1289 KB)
